Lang, Klaus-Dieter: шукати на сайті Z-Library

Найбільша колекція наукових статей у сіті. 70,000,000+ безкоштовних статей.

Пожертвування 15 вересня 2024 – 1 жовтня 2024

Z-Library - одна з найбільших онлайн-бібліотек у світі, в якій зберігається більше 17,000,000 книг та 84,837,000 статей. Ми намагаємось зробити літературу доступною кожному. Сьогодні (15 вересня 2024) ми відкриваємо додатковий збір пожертвувань на підтримку та розвиток проекту.

Також БЕЗЛІМТНІ завантаження (протягом 31 дня після завершення пожертвування) доступні для ВСІХ користувачів, які підтримають проект в період збору коштів до 1 жовтня 2024.

Про збір коштів Детальніше

Підтримати

Книги
Статті (190)
Найпопулярніші
Перелік
- Перелік
- Таблиця

Design and Application of a High-G Piezoresistive Acceleration Sensor for High-Impact Application

Hu, Xiaodong, Mackowiak, Piotr, Bäuscher, Manuel, Ehrmann, Oswin, Lang, Klaus-Dieter, Schneider-Ramelow, Martin, Linke, Stefan, Ngo, Ha-Duong

Журнал:

Micromachines

Рік:

2018

Мова:

english

Файл:

PDF, 2.33 MB

english, 2018

[IEEE 2014 IEEE International Symposium on Electromagnetic Compatibility - EMC 2014 - Raleigh, NC, USA (2014.8.4-2014.8.8)] 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) - Optimization of microstrip-to-via transition for highspeed differential signaling on printed circuit boards by suppression of the parasitic modes in shared antipads

Duan, Xiaomin, Hardock, Andreas, Ndip, Ivan, Schuster, Christian, Lang, Klaus-Dieter

Рік:

2014

Мова:

english

Файл:

PDF, 1.06 MB

english, 2014

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - LiTaO3 Capping Technology for Wafer Level Chip Size Packaging of SAW Filters

Zoschke, Kai, Wegner, Matthias, Lopper, Christina, Klein, Matthias, Gruenwald, Richard, Schoenbein, Clemens, Lang, Klaus-Dieter

Рік:

2016

Мова:

english

Файл:

PDF, 1.07 MB

english, 2016

[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Dry film photo resists and polymers - the low cost option for standard and 3-D wafer level packaging

Baumgartner, Tobias, Hauck, Karin, Topper, Michael, Manessis, Dion, Ehrmann, Oswin, Lang, Klaus-Dieter, Liebsch, Werner, Ehlin, Mats, Itabashi, Toshiaki

Рік:

2010

Мова:

english

Файл:

PDF, 845 KB

english, 2010

The influence of liners with Ti, Ta or Ru finish on thin Cu films

Gross, David, Haag, Sabine, Schneider-Ramelow, Martin, Lang, Klaus-Dieter

Журнал:

Microelectronics Reliability

Рік:

2014

Мова:

english

Файл:

PDF, 1.37 MB

english, 2014

[IEEE 2014 IEEE International Symposium on Electromagnetic Compatibility - EMC 2014 - Raleigh, NC, USA (2014.8.4-2014.8.8)] 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC) - On the optimization of the return current paths of signal vias in high-speed interposers and PCBs using the M3-approach

Ndip, Ivan, Lobbicke, Kai, Tschoban, Christian, Ranzinger, Christian, Richlowski, Karim, Contag, Andreas, Reichl, Herbert, Lang, Klaus-Dieter, Henke, Heino

Рік:

2014

Мова:

english

Файл:

PDF, 1.27 MB

english, 2014

[IEEE 2014 International Symposium on Electromagnetic Compatibility - EMC EUROPE - Gothenburg (2014.9.1-2014.9.4)] 2014 International Symposium on Electromagnetic Compatibility - Predicting magnetic coupling of power inductors

Hoffmann, Stefan, Hoene, Eckart, Lang, Klaus-Dieter

Рік:

2014

Мова:

english

Файл:

PDF, 1.20 MB

english, 2014

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - A sub-4 µm via technology of thinfilm polymers using scanning laser ablation

Topper, Michael, Hauck, Karin, Schima, Mario, Jaeger, Danny, Lang, Klaus-Dieter

Рік:

2015

Мова:

english

Файл:

PDF, 1.44 MB

english, 2015

Estimating the quantities of critical metals embedded in ICT and consumer equipment

Chancerel, Perrine, Marwede, Max, Nissen, Nils F., Lang, Klaus-Dieter

Журнал:

Resources, Conservation and Recycling

Рік:

2015

Мова:

english

Файл:

PDF, 2.06 MB

english, 2015

Heavy copper wire-bonding on silicon chips with aluminum-passivated Cu bond-pads

Gross, David, Haag, Sabine, Reinold, Manfred, Schneider-Ramelow, Martin, Lang, Klaus-Dieter

Журнал:

Microelectronic Engineering

Рік:

2015

Мова:

english

Файл:

PDF, 1.21 MB

english, 2015

[IEEE 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) - Grenoble, France (2015.5.18-2015.5.21)] 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) - Aluminum-capped copper bond pads for ultrasonic heavy copper wire-bonding on power devices

Gross, David, Haag, Sabine, Reinold, Manfred, Schneider-Ramelow, Martin, Lang, Klaus-Dieter

Рік:

2015

Мова:

english

Файл:

PDF, 149 KB

english, 2015

Modeling and characterization of PCB coils for inductive wireless charging

Curran, Brian, Maaß, Uwe, Fotheringham, Gerhard, Stevens, Nobby, Ndip, Ivan, Lang, Klaus-Dieter

Журнал:

Wireless Power Transfer

Рік:

2015

Мова:

english

Файл:

PDF, 835 KB

english, 2015

Characterisation of Cu/Cu bonding using self-assembled monolayer

Lykova, Maria, Panchenko, Iuliana, Künzelmann, Ulrich, Reif, Johanna, Geidel, Marion, Wolf, M. Jürgen, Lang, Klaus-Dieter

Журнал:

Soldering & Surface Mount Technology

Рік:

2018

Мова:

english

Файл:

PDF, 376 KB

english, 2018

[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Innovative Excimer Laser Dual Damascene Process for Ultra-Fine Line Multi-layer Routing with 10 µm Pitch Micro-Vias for Wafer Level and Panel Level Packaging

Woehrmann, Markus, Hichri, Habib, Gernhardt, Robert, Hauck, Karin, Braun, Tanja, Toepper, Michael, Arendt, Markus, Lang, Klaus-Dieter

Рік:

2017

Мова:

english

Файл:

PDF, 622 KB

english, 2017

Nonoverlapping Power/Ground Planes for Suppression of Power Plane Noise

Engin, Arif Ege, Ndip, Ivan, Lang, Klaus-Dieter, Aguirre, Gerardo

Журнал:

IEEE Transactions on Components Packaging and Manufacturing Technology

Рік:

2018

Мова:

english

Файл:

PDF, 1.95 MB

english, 2018

Development and Characterization of a Novel Low-Cost Water-Level and Water Quality Monitoring Sensor by Using Enhanced Screen Printing Technology with PEDOT:PSS

Wang, Bei, Baeuscher, Manuel, Hu, Xiaodong, Woehrmann, Markus, Becker, Katharina, Juergensen, Nils, Hubl, Moritz, Mackowiak, Piotr, Schneider-Ramelow, Martin, Lang, Klaus-Dieter, Ngo, Ha-Duong

Журнал:

Micromachines

Рік:

2020

Файл:

PDF, 5.54 MB

2020

On the Vacuum Ultraviolet Radiation of a Miniaturized Non-thermal Atmospheric Pressure Plasma Jet

Rüdiger Foest, Thomas Bindemann, Ronny Brandenburg, Eckhard Kindel, Hartmut Lange, Manfred Stieber, Klaus-Dieter Weltmann

Журнал:

Plasma Processes and Polymers

Рік:

2007

Мова:

english

Файл:

PDF, 168 KB

english, 2007

Investigation of microstructural processes during ultrasonic wedge/wedge bonding of AlSi1 wires

Ute Geißler, Martin Schneider-Ramelow, Klaus-Dieter Lang, Herbert Reichl

Журнал:

Journal of Electronic Materials

Рік:

2006

Мова:

english

Файл:

PDF, 299 KB

english, 2006

Advances in CO2-Laser Drilling of Glass Substrates

Lars Brusberg, Marco Queisser, Clemens Gentsch, Henning Schröder, Klaus-Dieter Lang

Журнал:

Physics Procedia

Рік:

2012

Мова:

english

Файл:

PDF, 1.10 MB

english, 2012

[IEEE 2012 IEEE Sensors - Taipei, Taiwan (2012.10.28-2012.10.31)] 2012 IEEE Sensors - Liquid-free, piezoresistive, SOI-based pressure sensor for high temperature measurements up to 400 °C

Ngo, Ha-Duong, Mukhopadhyay, Biswaijit, Thanh, Vu Cong, Mackowiak, Peter, Schlichting, Volker, Obermeier, Ernst, Lang, Klaus-Dieter, Giuliani, Andrea, Drera, Lionello, Arancio, Domenico

Рік:

2012

Мова:

english

Файл:

PDF, 2.60 MB

english, 2012

Analytical, Numerical-, and Measurement–Based Methods for Extracting the Electrical Parameters of Through Silicon Vias (TSVs)

Ndip, Ivan, Zoschke, Kai, Lobbicke, Kai, Wolf, M. Jurgen, Guttowski, Stephan, Reichl, Herbert, Lang, Klaus-Dieter, Henke, Heino

Журнал:

IEEE Transactions on Components Packaging and Manufacturing Technology

Рік:

2014

Мова:

english

Файл:

PDF, 1.93 MB

english, 2014

[IEEE 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Singapore (2013.12.11-2013.12.13)] 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - An advanced MEMS sensor packaging concept for use in harsh environments

von Berg, Jochen, Cavalloni, Claudio, Mukhopadhyay, Biswajit, Mackowiak, Piotr, Ehrmann, Oswin, Lang, Klaus-Dieter, Ngo, Ha-Duong

Рік:

2013

Мова:

english

Файл:

PDF, 1.10 MB

english, 2013

[IEEE 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Belgium (2014.04.7-2014.04.9)] 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Modelling the lifetime of aluminum heavy wire bond joints with a crack propagation law

Grams, Arian, Prewitz, Tobias, Wittler, Olaf, Schmitz, Stefan, Middendorf, Andreas, Lang, Klaus-Dieter

Рік:

2014

Мова:

english

Файл:

PDF, 963 KB

english, 2014

[IEEE 2013 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Berlin, Germany (2013.09.25-2013.09.27)] 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Approach for reliability of Thermal Interface Materials in battery cell sensors

Nowak, Torsten, Muller, Matthias, Walter, Hans, Holck, Ole, Wust, Felix, Wittler, Olaf, Lang, Klaus-Dieter

Рік:

2013

Мова:

english

Файл:

PDF, 666 KB

english, 2013

Welding Equipment under the Energy-related Products Directive

Schischke, Karsten, Nissen, Nils F., Lang, Klaus-Dieter

Журнал:

Journal of Industrial Ecology

Рік:

2014

Мова:

english

Файл:

PDF, 493 KB

english, 2014

[IEEE 2014 International Power Electronics Conference (IPEC-Hiroshima 2014 ECCE-ASIA) - Hiroshima, Japan (2014.5.18-2014.5.21)] 2014 International Power Electronics Conference (IPEC-Hiroshima 2014 - ECCE ASIA) - Modeling method of stray magnetic couplings in an EMC filter for a SiC solar inverter

Masuzawa, Takashi, Hoene, Eckart, Hoffmann, Stefan, Lang, Klaus-Dieter

Рік:

2014

Мова:

english

Файл:

PDF, 2.49 MB

english, 2014

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Early-state crack detection method for heel-cracks in wire bond interconnects

Kruger, Michael, Trampert, Stefan, Middendorf, Andreas, Schmitz, Stefan, Lang, Klaus-Dieter

Рік:

2014

Мова:

english

Файл:

PDF, 2.78 MB

english, 2014

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - CO2-laser drilling of TGVs for glass interposer applications

Brusberg, Lars, Queisser, Marco, Neitz, Marcel, Schroder, Henning, Lang, Klaus-Dieter

Рік:

2014

Мова:

english

Файл:

PDF, 1.12 MB

english, 2014

[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Development of a high density glass interposer based on wafer level packaging technologies

Topper, Michael, Wohrman, Markus, Brusberg, Lars, Jurgensen, Nils, Ndip, Ivan, Lang, Klaus-Dieter

Рік:

2014

Мова:

english

Файл:

PDF, 3.44 MB

english, 2014

SPIE Proceedings [SPIE SPIE Security + Defence - Dresden, Germany (Monday 23 September 2013)] Emerging Technologies in Security and Defence; and Quantum Security II; and Unmanned Sensor Systems X - Optical system components for navigation grade fiber optic gyroscopes

Heimann, Marcus, Liesegang, Maximilian, Arndt-Staufenbiel, Norbert, Schröder, Henning, Lang, Klaus-Dieter, Lewis, Keith L., Hollins, Richard C., Merlet, Thomas J., Gruneisen, Mark T., Dusek, Miloslav,

Рік:

2013

Мова:

english

Файл:

PDF, 894 KB

english, 2013

[IEEE 2014 International Symposium on Electromagnetic Compatibility - EMC EUROPE - Gothenburg (2014.9.1-2014.9.4)] 2014 International Symposium on Electromagnetic Compatibility - Analysis and improvement of a spark plug for less radiated electromagnetic emissions

Marczok, Christoph, Maass, Uwe, Hoene, Eckart, Ndip, Ivan, Lang, Klaus-Dieter, Hasselberg, Dennis

Рік:

2014

Мова:

english

Файл:

PDF, 949 KB

english, 2014

Efficient Computation of Localized Fields for Through Silicon Via Modeling Up to 500 GHz

Dahl, David, Duan, Xiaomin, Ndip, Ivan, Lang, Klaus-Dieter, Schuster, Christian

Журнал:

IEEE Transactions on Components Packaging and Manufacturing Technology

Рік:

2015

Мова:

english

Файл:

PDF, 2.84 MB

english, 2015

A Rigorous Approach for the Modeling of Through-Silicon-Via Pairs Using Multipole Expansions

Xiaomin Duan,, Dahl, David, Ndip, Ivan, Lang, Klaus-Dieter, Schuster, Christian

Журнал:

IEEE Transactions on Components Packaging and Manufacturing Technology

Рік:

2016

Мова:

english

Файл:

PDF, 1.91 MB

english, 2016

[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Thin glass based electro-optical circuit board (EOCB) with through glass vias, gradient-index multimode optical waveguides and collimated beam mid-board coupling interfaces

Brusberg, Lars, Schroder, Henning, Ranzinger, Christian, Queisser, Marco, Herbst, Christian, Marx, Sebastian, Hofmann, Jens, Neitz, Marcel, Pernthaler, Dominik, Lang, Klaus-Dieter

Рік:

2015

Мова:

english

Файл:

PDF, 1.73 MB

english, 2015

[IEEE 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Montpellier, France (2016.4.18-2016.4.20)] 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Reliability analysis of solder joints under different thermal and thermo-mechanical loading conditions: Case study of automotive ECUs

Youssef, Abdalla, Birner, Ingo, Voelkel, Holger, Thierauf, Jean, Vodiunig, Robert, Middendorf, Andreas, Lang, Klaus-Dieter

Рік:

2016

Мова:

english

Файл:

PDF, 398 KB

english, 2016

[IEEE 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Budapest, Hungary (2015.4.19-2015.4.22)] 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - A geometry-independent lifetime modelling method for aluminum heavy wire bond joints

Grams, Arian, Hofer, Jan, Middendorf, Andreas, Schmitz, Stefan, Wittler, Olaf, Lang, Klaus-Dieter

Рік:

2015

Мова:

english

Файл:

PDF, 5.30 MB

english, 2015

Investigation of All Wet Chemical Process for the Barrier Formation in High Aspect Ratio Silicon Vias

Sandjaja, Marco, Stolle, Thomas, Bund, Andreas, Lang, Klaus-Dieter

Журнал:

IEEE Transactions on Electron Devices

Рік:

2016

Мова:

english

Файл:

PDF, 2.33 MB

english, 2016

Aluminum-Scandium: A Material for Semiconductor Packaging

Geissler, Ute, Thomas, Sven, Schneider-Ramelow, Martin, Mukhopadhyay, Biswajit, Lang, Klaus-Dieter

Журнал:

Journal of Electronic Materials

Рік:

2016

Мова:

english

Файл:

PDF, 3.47 MB

english, 2016

[IEEE 2016 11th European Microwave Integrated Circuits Conference (EuMIC) - London, United Kingdom (2016.10.3-2016.10.4)] 2016 11th European Microwave Integrated Circuits Conference (EuMIC) - Dielectric material characterization of high frequency printed circuit board laminates and an analysis of their transmission line high frequency losses

Curran, Brian, Tschoban, Christian, Ndip, Ivan, Lang, Klaus-Dieter, Kroener, Helmut, Ippich, Alexander

Рік:

2016

Мова:

english

Файл:

PDF, 322 KB

english, 2016

[IEEE 2016 6th Electronic System-Integration Technology Conference (ESTC) - Grenoble, France (2016.9.13-2016.9.15)] 2016 6th Electronic System-Integration Technology Conference (ESTC) - Large area processes for 3D shaped electronics

Ostmann, Andreas, Loeher, Thomas, Seckel, Manuel, Lang, Klaus-Dieter

Рік:

2016

Мова:

english

Файл:

PDF, 16.36 MB

english, 2016

Power Plane Filter Using Higher Order Virtual Ground Fence

Engin, A. Ege, Ndip, Ivan, Lang, Klaus-Dieter, Aguirre, Gerardo

Журнал:

IEEE Transactions on Components Packaging and Manufacturing Technology

Рік:

2017

Мова:

english

Файл:

PDF, 2.08 MB

english, 2017

Efficient Total Crosstalk Analysis of Large Via Arrays in Silicon Interposers

Dahl, David, Reuschel, Torsten, Preibisch, Jan Birger, Duan, Xiaomin, Ndip, Ivan, Lang, Klaus-Dieter, Schuster, Christian

Журнал:

IEEE Transactions on Components Packaging and Manufacturing Technology

Рік:

2016

Мова:

english

Файл:

PDF, 2.83 MB

english, 2016

[IEEE 2017 IEEE 21st Workshop on Signal and Power Integrity (SPI) - Lake Maggiore, Italy (2017.5.7-2017.5.10)] 2017 IEEE 21st Workshop on Signal and Power Integrity (SPI) - Effect of 3D stack-up integration on through silicon via characteristics

Dahl, David, Ndip, Ivan, Lang, Klaus-Dieter, Schuster, Christian

Рік:

2017

Мова:

english

Файл:

PDF, 597 KB

english, 2017

[IEEE 2016 Electronics Goes Green 2016+ (EGG) - Berlin, Germany (2016.9.6-2016.9.9)] 2016 Electronics Goes Green 2016+ (EGG) - Experts View on the Sustainability of the Fairphone 2

Proske, Marina, Schischke, Karsten, Sommer, Philipp, Trinks, Tina, Nissen, Nils F., Lang, Klaus-Dieter

Рік:

2016

Мова:

english

Файл:

PDF, 491 KB

english, 2016

Closed-Form Multipole Debye Model for Time-Domain Modeling of Lossy Dielectrics

Engin, Arif Ege, Ndip, Ivan, Lang, Klaus-Dieter, Aguirre, Jerry

Журнал:

IEEE Transactions on Electromagnetic Compatibility

Рік:

2018

Мова:

english

Файл:

PDF, 430 KB

english, 2018

A WSi–WSiN–Pt Metallization Scheme for Silicon Carbide-Based High Temperature Microsystems

Ngo, Ha-Duong, Mukhopadhyay, Biswajit, Mackowiak, Piotr, Kröhnert, Kevin, Ehrmann, Oswin, Lang, Klaus-Dieter

Журнал:

Micromachines

Рік:

2016

Мова:

english

Файл:

PDF, 1.94 MB

english, 2016

Advanced Liquid-Free, Piezoresistive, SOI-Based Pressure Sensors for Measurements in Harsh Environments

Ngo, Ha-Duong, Mukhopadhyay, Biswaijit, Ehrmann, Oswin, Lang, Klaus-Dieter

Журнал:

Sensors

Рік:

2015

Мова:

english

Файл:

PDF, 2.77 MB

english, 2015

Mixed-Port Scattering and Hybrid Parameters for High-Speed Differential Lines

Engin, Arif Ege, Ndip, Ivan, Lang, Klaus-Dieter, Aguirre, Gerardo

Журнал:

IEEE Transactions on Electromagnetic Compatibility

Рік:

2018

Мова:

english

Файл:

PDF, 747 KB

english, 2018

[IEEE 2018 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO) - Reykjavik, Iceland (2018.8.8-2018.8.10)] 2018 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO) - Differential-Line Characterization Using Mixed-Port Scattering Parameters

Engin, A. Ege, Ndip, Ivan, Lang, Klaus-Dieter, Aguirre, Jerry

Рік:

2018

Мова:

english

Файл:

PDF, 295 KB

english, 2018

[IEEE 2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Stockholm, Sweden (2018.9.26-2018.9.28)] 2018 24rd International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Thermal Management of a Ka Band Satellite Communication Module Using Finite Element Models and Thermal Imaging

Grams, Arian, Curran, Brian, Kuttler, Simon, Reyes, Jacob, Wist, Felix, Lang, Klaus-Dieter

Рік:

2018

Мова:

english

Файл:

PDF, 633 KB

english, 2018